Method of forming contact bumps in contact pads
US4891014A · kind A · utility
18Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1989 |
| Grant date | Jan 2, 1990 |
| Priority date | — |
| Expiry date | Mar 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.