Multilayer systems and their method of production
US4891259A · kind A · utility
Inventor
Key dates
| Filing date | May 12, 1988 |
| Grant date | Jan 2, 1990 |
| Priority date | — |
| Expiry date | May 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer system comprises a seed layer (4) of copper deposited on an electrically insulating substrate (2). The seed layer (4) carries a copper pattern (8). An air fired dielectric (10) encapsulates the pattern (8) and the exposed parts of the seed layer (4). The outer skin of the pattern is oxidized as is also the whole of the seed layer other than where it underlies the copper pattern. The oxidized regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxygen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes (12) produced in the dielectric enable electrical connection to the pattern (8).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.