Process for production of electronic devices utilizing novolak resin as protective material
US4891334A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 8, 1988 |
| Grant date | Jan 2, 1990 |
| Priority date | — |
| Expiry date | Nov 8, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/976
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A protective material for electronic parts comprises monoalkylated phenol.formaldehyde novolak resin having 6 to 12 carbon atoms in the alkyl group, and a process for the production of electronic parts, which comprises the following steps A to C: PA1 A. covering a device side surface of a semiconductor plate on which semiconductor elements and so forth are mounted with a protective film of a protective material comprising monoalkylated phenol.formaldhyde novolak resin having 6 to 12 carbon atoms in the alkyl group; PA1 B. finishing the other or backside surface of the semiconductor plate, not covered with the protective film, to reduce the thickness of the plate; and PA1 C. removing the protective film with a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.