Process for the passivating anodization of copper in a medium of molten fluorides, and use for the protection of copper parts of fluorine electrolysers
US4892630A · kind A · utility
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13Claims
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Key dates
| Filing date | Feb 23, 1989 |
| Grant date | Jan 9, 1990 |
| Priority date | — |
| Expiry date | Feb 23, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D11/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for producing a strong, adherent protective layer on copper parts, with a high rate of covering of the substrate, by passivating anodization, characterized in that the copper parts are immersed in a liquid KF, 2HF bath and subjected to anodic current of low surface-related density which is less than 0.1 A/dm.sup.2, which current may be continuous or intermittent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.