Semiconductor integrated circuit device including bonding pads and fabricating method thereof
US4893168A · kind A · utility
30Cited by
7References
24Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 2, 1982 |
| Grant date | Jan 9, 1990 |
| Priority date | — |
| Expiry date | Jun 2, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Herein disclosed is a semiconductor integrated circuit device which includes a unit cell for forming such an input/output circuit portion as is made capable of selecting any of a plurality of different input and output functions by changing a wiring pattern. The semiconductor integrated circuit is constructed such that there are formed in a manner to correspond to the unit cell a plurality of bonding pad regions which can be separated from one another so that any of the plural input and output functions can be arbitrarily selected through those bonding pad regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.