Patent · US Expired

Lead frame and a process for the production of a lead with this lead frame

US4893169A · kind A · utility

5Cited by

5References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Helmut Rusch · Regensburg, DE
Guenter Waitl · Regensburg, DE
Hansjoerg Harrasser · Regensburg, DE
Hans J. Richter · Palo Alto, US
Lee FRANCIS · Milton Keynes, GB
Alois Seidl
Hans Wissinger · Regensburg, DE
Hans-Joachim Hampel

Key dates

Filing date	Mar 28, 1988
Grant date	Jan 9, 1990
Priority date	—
Expiry date	Mar 28, 2008

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.