Method for producing a multilayer printed wiring board
US4893404A · kind A · utility
41Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1988 |
| Grant date | Jan 16, 1990 |
| Priority date | — |
| Expiry date | Sep 13, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a multilayer printed wiring board by the buildup process. A first layer printed wiring pattern (13) is formed on a metal core (11) over a first insulating laminate (12), and second layer printed wiring pattern (16) is formed on the first layer printed wiring pattern over through studs (15) and a second insulating laminate (14). The surface of the first layer printed wiring pattern (13) is roughened and the through studs (15) are formed by the buildup process using a conductive paste on the roughened surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.