Metal-core printed wiring board and a process for manufacture thereof
US4894271A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 1988 |
| Grant date | Jan 16, 1990 |
| Priority date | — |
| Expiry date | May 6, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.