Bonding additives for refractory metallization inks
US4894273A · kind A · utility
11Cited by
2References
20Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 16, 1988 |
| Grant date | Jan 16, 1990 |
| Priority date | — |
| Expiry date | Jun 16, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.