Method for bonding materials
US4895290A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1986 |
| Grant date | Jan 23, 1990 |
| Priority date | — |
| Expiry date | Mar 3, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/0622
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasonic transducer and its method of fabrication wherein bonding between an impedance matching layer on one side of a piezoelectric layer and a support layer on the other side of the piezoelectric material is made by providing onto each material a smooth, thin gold film on the smooth surfaces of the layers which are to be in contact with one another in the assembled transducer. The layers are bonded to each other by the gold films under moderate temperature and pressure to form the transducer. Sawing of the impedance matching and piezoelectric layers into a plurality of parallel transducers attached to the support layer forms an array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.