Controlled impedance connector
US4895523A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 1988 |
| Grant date | Jan 23, 1990 |
| Priority date | — |
| Expiry date | Nov 7, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A very high density, multiple contact connector has low-inductance power and ground planes and gold dot contacts for providing a controlled impedance environment to a module assembly by minimizing undesirable effects such as ground-noise and reflections while assuring operation at interconnect bandwidths up to 6 GHz. The controlled impedance connector connects two printed wiring boards (PWBs) comprising surface mounted devices to a motherboard. The PWBs are bonded to opposite sides of a central heat frame. The connector has two flexible circuits containing a total of 460 gold dot signal connections plus a plurality of separate gold dot power and ground connections. Signal runs between the PWBs and the connector flexible circuits are interconnected using copper fingers soldered to pads on the PWBs. Power and ground planes connect to the PWBs via gold dot contacts on the inside of the flexible circuit surface to pads on the PWBs. The connector is a true zero insertion force design. A clamping mechanism comprising jacking screws pulls the spring-loaded gold dots on the flexible circuit of the connector against the pads on a motherboard. A clamping force of 200 pounds is used to achiev…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.