Lead frame assembly having severable electrical circuit sections
US4895536A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1988 |
| Grant date | Jan 23, 1990 |
| Priority date | — |
| Expiry date | Jul 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/937
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lead frame assembly comprises a stamped and formed lead frame having spaced pairs of electrical terminals and other contact sections. Severable sections initially interconnect potential electrical circuit sections of the lead frame separating the lead frame into separate metal members defining discrete electrical circuits if severed. A dielectric covering is molded over the lead frame exposing the pairs of terminals and other contact sections for termination or electrical engagement. Openings are formed in the housing exposing the severable sections of the lead frame for severing, to be selectively severed creating separate electrical circuit sections, or to be retained unsevered, as desired. After the molding of the covering over the lead frame, the article thus fabricated can be customized by selective severing and connecting of components as desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.