Process and apparatus for controlling the reactive deposit of coatings on substrates by means of magnetron cathodes
US4895631A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1989 |
| Grant date | Jan 23, 1990 |
| Priority date | — |
| Expiry date | Mar 20, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3444
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A reaction gas is admitted in the immediate vicinity of a target on the cathode and a plasma is generated between the target and a substrate to be coated. The intensity of the spectral line of a target material is measured, and is used to provide a first signal with a relatively short time constant to a controller via a first control circuit. A property of the finished coating is sensed after the substrate leaves the coating zone, and is used to provide a second signal with a relatively long time constant to the controller via a second control circuit. The controller uses the combined signals to regulate the admission of the reaction gas so that a pre-established property of the finished coating is kept substantially constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.