Process for lowering the dielectric constant of polyimides using diamic acid additives

US4895972A · kind A · utility

Assignee

• The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · US

Inventors

• Diane M. Stoakley · Yorktown, US
• Anne K. St. Clair · Poquoson, US

Key dates

• Filing date: Sep 1, 1988
• Grant date: Jan 23, 1990
• Expiry date: Sep 1, 2008

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01B3/306
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Linear aromatic polyimides with low dielectric constants are produced by adding a diamic acid additive to the polyamic acid resin formed by the condensation of an aromatic dianhydride with an aromatic diamine. The resulting modified polyimide is a better electrical insulator than state-of-the-art commercially available polyimides.