Subassembly for optoelectronic devices
US4897711A · kind A · utility
160Cited by
19References
19Claims
0Family size
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Key dates
| Filing date | Mar 3, 1988 |
| Grant date | Jan 30, 1990 |
| Priority date | — |
| Expiry date | Mar 3, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4231
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A subassembly for use in packaging an optoelectronic device (e.g., LED or photodiode) includes a semiconductor (e.g., silicon) base and lid having a variety of etched features (e.g., grooves, cavities, alignment detents) and metalization patterns (e.g., contacts, reflectors) which enable the device to be reliably and inexpensively mounted on the base and coupled to the fiber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.