Electroplating apparatus for plate-shaped workpieces
US4898657A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 26, 1989 |
| Grant date | Feb 6, 1990 |
| Priority date | — |
| Expiry date | Jun 26, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/005
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus, which has the workpieces, such as printed circuit boards, being conducted through an electrolyte solution in a horizontal path, has cathodic contacting by contact clamps, which move with the workpiece through the device. In order to guarantee a reliable supply of cathode current with a low thermal heating and a low wear of the contacts, which are also simultaneously resistant to the corrosion of the conducting parts, a live rail is provided that comprises a core composed of a material of high electrical conductivity, such as copper, and is covered by an envelope composed of a material having a high resistance to corrosion, such as titanium. Contact springs, preferably composed of titanium, are connected to the live rail in a mechanical and electrical conductive fashion, such as by spot welding, and engage each of the contact clamps as they move along the path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.