Flex dot wafer probe
US4899099A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1988 |
| Grant date | Feb 6, 1990 |
| Priority date | — |
| Expiry date | May 19, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A flex dot wafer probe having utility as an electrical interface between semiconductor wafers and electronic test systems for determining the electrical integrity and performance of integrated circuits. The wafer probe comprises a wafer probe head having a preformed resilient, bendable, formable film mounted on a support member for flexible movement. The wafer probe head is integrated with a probe board which interfaces with an external test system. Wafer contact pads and protrusions are formed on the film in "mirror-image" patterns corresponding to the contact elements of the integrated circuits and interface contact pads of the probe board, respectively. Coplanar line conductors, formed to control the characteristic impedance of the wafer probe head, provide electrical continuity between the wafer contact pads and the protrusions. The conductive protrusions formed on the wafer contact pads and the film physically and electrically engage the contact elements of the integrated circuits and the probe board, respectively, thereby providing electrical paths for test signals between the external test system and the integrated circuits. The flexible configuration of the wafer probe head…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.