Aligner bonder
US4899921A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1988 |
| Grant date | Feb 13, 1990 |
| Priority date | — |
| Expiry date | Oct 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aligner bonder for joining parts of a miniature semiconductor component, for example, comprises supports for holding the parts with surfaces facing, positioning provisions for adjusting relative positions and inclinations of the parts and for bringing the facing surfaces together for bonding. A first inclined two-sided mirror directs light from a pair of illuminators to the surfaces. Images of the surfaces are diverted from the inclined reflective mirror faces to optical paths and then to video cameras. Individual video circuitry and illuminator adjustments permit adjustment of each video image. The images are combined in a single video image displayed on a monitor. The supports for the parts are positionally adjusted to bring the video images into alignment. To adjust parallelism, autocollimators and associated reference image cross hairs project reference images via another inclined two-sided mirror to the surfaces of the parts or parallel reference surfaces. The reference image projected to the surfaces are reflected back to the video cameras via the reflective faces of the second two-sided mirror and associated optical paths. The positional relationship of the two reference …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.