Method and apparatus for encapsulating semi-conductors
US4900501A · kind A · utility
24Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1986 |
| Grant date | Feb 13, 1990 |
| Priority date | — |
| Expiry date | Oct 30, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.