Nickel-base solder for high-temperature solder joints
US4900638A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 14, 1988 |
| Grant date | Feb 13, 1990 |
| Priority date | — |
| Expiry date | Mar 14, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Nickel-based solder compositions having improved wetting behavior, the soldering alloys containing aluminum and chromium, and one or more of the metals zirconium, niobium, or titanium added to the solder in amounts of from 0.1 to 5 atomic percent. Particularly effective soldering alloys contain 0 to 4 atomic percent iron, 0 to 21 atomic percent chromium, 0 to 19 atomic percent boron, 0 to 12 atomic percent silicon, 0 to 22 atomic percent phosphorus, 0 to 3 atomic percent carbon, and 0.1 to 5 atomic percent niobium, zirconium, or titanium, the remainder being nickel, the boron, carbon, silicon, and phosphorus concentrations totaling from 16 to 24 atomic percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.