Heat transfer decorations with patterned metallization
US4902364A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Aug 2, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A metallized laminate and process of manufacture wherein a metallic layer or underlying ink layer appears in a pattern on the laminate. The method in a specific embodiment involves the steps of forming a laminate by coating a heat stable release coat onto a carrier sheet; coating an ink layer in a pattern on the heat stable release coating so that at least portions of the release coat remain uncovered with ink, and applying a metallic layer over the release coat so that at least a portion of the metallic layer is in direct contact with and adheres directly to the release coat. Portions of the metallic layer may be removed by an etchant. A heat activatable adhesive layer is applied over the metallic layer. The laminate so formed is heat transferable from the carrier sheet to an article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.