Process for treating copper surface
US4902551A · kind A · utility
74Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Jul 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.