Film deposition system
US4902572A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Apr 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film deposition system is provided for depositing a film of at least first and second materials onto a common target. This system includes a housing within which the common target is located and within which a high vacuum region may be formed. The system further includes first and second crucibles each containing respective first and second materials to be deposited; a heating element and/or cooling element for vaporizing the materials in each of the first and second crucibles, respectively; first and second nozzles for ejecting the vaporized material from the first and second crucibles into the high vacuum region to form non-ionized atomic clusters by adiabatic expansion with those clusters traveling in first and second directions, respectively, each of which are non-coincident with the common target; first and second electron strippers for converting a portion of those non-ionized clusters to ionize clusters of the first and second materials; first and second accelerators for accelerating the ionized clusters of the first and second materials; and first and second deflectors for deflecting the ionized clusters of first and second materials to third and fourth directions, respec…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.