Method of preventing superficial electrical discharges in chips of semiconductor devices during testing
US4902632A · kind A · utility
0Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Dec 21, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/958
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The method consists of subjecting the semiconductor chips to chemical treatment with a silanizing agent immediately before testing to prevent superficial electrical discharges which can reduce the testing voltage which can be applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.