Polymer interconnect structure
US4902857A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Dec 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive polymer interconnect structure (10) is comprised of an insulative polymer (18), a silicone or an epoxy, having a plurality of particles (20) arranged therein to provide conductive paths which extend in the z direction. At least a portion of those particles (20) proximate a separate one of the major surfaces of the matrix has at least a portion thereof coated with a solder 24 whose composition is tailored to melt below the cure temperature of the matrix (18). In this way, when the matrix (18) is sandwiched between a pair of conductive members (12 and 14) and the matrix is cured, a metallurgical bond, rather than a mechanical bond, will be formed between the members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.