Resin-molded semiconductor
US4903114A · kind A · utility
34Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1988 |
| Grant date | Feb 20, 1990 |
| Priority date | — |
| Expiry date | Jun 15, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying wire bonding connection between the semiconductor chip or chips and inner leads of the lead-frame are formed and arranged so as to correspond to the inner-leads, for electrically insulating the semiconductor chip or chips and the relay-pads from the metal die-stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.