Method for controlling an oxide layer metallic substrates by laser
US4904498A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 1989 |
| Grant date | Feb 27, 1990 |
| Priority date | — |
| Expiry date | May 15, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a method for controlling or limiting the formation of an oxide layer on a metallic substrate such as nickel or nickel alloy, over which a polymeric plating resist has been placed, then selectively removed by a focussed excimer laser beam applied thereto. The method comprises the steps of applying a carbon-containing polymeric plating resist to a metal substrate having an oxide layer thereon of a thickness between about 20 to 40.ANG.. Thereafter, a selected area of said resist coated metal substrate is subjected to a single shot from an excimer laser to ablate said resist from within said area, wherein the laser energy is absorbed primarily at the metallic substrate and the energy density of the said laser is in excess of that required to ablate so as to produce a thin uniform layer of oxide over said substrate, said oxide layer, principally nickel oxide, having a thickness no greater than about 7.ANG.. Ancillary features of this method include improved substrate surface characteristics by the development of a carbon enriched sub-surface layer beneath the ablated area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.