Hermetic semiconductor enclosure
US4905075A · kind A · utility
27Cited by
19References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1988 |
| Grant date | Feb 27, 1990 |
| Priority date | — |
| Expiry date | Dec 21, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/905
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor hermetic package for semiconductor device comprises base, sidewall and cover members. Signals can be coupled between the enclosed devices and external devices by coupling means including conductive regions disposed in and through the package. Light pipes or conductive tracks and paths extending through the package can be used to couple the signals. A portion of the package can function as a grading resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.