Semiconductor hall element with magnetic powder in resin
US4905318A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1989 |
| Grant date | Feb 27, 1990 |
| Priority date | — |
| Expiry date | Mar 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/00
Abstract
A highly magnetic Hall element comprising a substrate, a Hall element chip mounted on the substrate, and a magnetic member interposed between the substrate and the chip. The magnetic member increases the coercive force of the element, and is formed by laminating resin layers mixed with powder having a high magnetic permeability, one upon another, by stencil printing on that side of a semiconductor wafer in which a Hall element is mounted. The wafer and the magnetic member are diced together, to provide a Hall element chip. The magnetic member formed on the Hall element chip is adhered to substrate, with half-cured surface put in contact with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.