High density connector for an IC chip carrier
US4906194A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 1989 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | Apr 13, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high density connector assembly for an IC chip carrier (10) includes a stack of spacer plated (30) having apertures (32) which form chambers for holding planar contact members (22) therein. The stack of spacer plates (30) are sandwiched between a lower reference plate (34) and an upper reference plate (36) which have precisely located apertures (42, 44) communicating with the chambers for precisely positioning contact portions (26, 28) of the contact members (22) with respect to contact pads (14, 18) on the IC chip module (10) and a printed circuit board (12). The plates (30, 34, 36) are preferably formed of a dielectric coated metal material to provide a ground shield around the contact members (22) to prevent cross talk therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.