Process for electroplating metals
US4906340A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 1989 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | May 31, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25C7/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for electroplating metals in an electroplating cell in which the anode current efficiency of the cell is greater than the cathode current efficiency. Buildup of excess metal in the cell is counteracted by circulating the plating solution through an electrowinning cell and plating out the excess metal onto cathodes in the electrowinning cell. The amount of current flowing through the electrowinning cell is controlled so that the amount of the said current which results in the deposition of metal is at least substantially equal to the amount of current flowing through the electroplating cell which results in the evolution of hydrogen gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.