Die attach adhesive composition
US4906596A · kind A · utility
18Cited by
15References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1989 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | Jul 20, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composition which is useful for bonding integrated circuits to inorganic dielectric substrates comprising an admixture of finely divided particles of a thermally conductive metal or metal-containing compound, non-aqueously milled amorphous glass frit and fatty acid-based surfactant dispersed, in a solution of primary organic solvent selected from ethylene glycol monobutyl ether acetate, dimethyl adipate and mixtures thereof and optionally minor amounts of certain secondary solvents and an acrylic polymer which is free of polar functional groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.