Encapsulated thermoelectric heat pump and method of manufacture
US4907060A · kind A · utility
Inventors
Key dates
| Filing date | Jun 2, 1987 |
| Grant date | Mar 6, 1990 |
| Priority date | — |
| Expiry date | Jun 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
Abstract
An encapsulated thermoelectric heat pump, apparatus and method for manufacturing the encapsulated thermoelectric heat pump is disclosed. The encapsulated thermoelectric heat pump includes a plurality of spaced n-type and p-type thermoelectric elements arranged alternatively in rows and columns. The thermoelectric elements having opposing ends operatively connected to first and second metalized ceramic substrates. The first and second metalizations patterned to connect serially the thermoelectric elements. The space between the spaced thermoelectric elements is filled with a microballoon filled epoxy for substantially increasing the strength of the thermoelectric heat pump to withstand a stress of more than 2000 g's. The apparatus includes a mold cup holding the encapsulating material, a mold holding the thermoelectric heat pump mounted in the mold cup, and a vacuum means connected to the mold for drawing the encapsulating material upwardly through the spaces of the plurality of thermoelectric elements to fill the spaces for curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.