Method of bonding gold or gold alloy wire to lead tin solder
US4907734A · kind A · utility
35Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1988 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | Oct 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.