Encapsulating compositions
US4908399A · kind A · utility
3Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1988 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | Nov 14, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/549
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An encapsulating composition for electronic devices comprises a curable material such as an epoxy resin and an ion scavenger compound selected from certain calixarene or oxycalixarene compounds in which at least half of the phenolic groups have been substituted by specific groups and certain silacrown compounds. Exemplary ion scavenger compounds include ##STR1## the tetraethyl acetate of 7, 13, 19, 25-tetra-tertbutyl-27, 28, 29, 30-tetrahydroxy-2,3-dihomo-3-oxacalix-4-arene and 1,1-dimethasila-17-crown-6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.