Thermosetting resin composition
US4908417A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 1989 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | May 2, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition is prepared by mixing PA0 (A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups, PA0 (B) a polymaleimide compound having two or more maleimide groups in the molecule, and PA0 (C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.