Thermoplastic molding compounds containing aliphatic polycarbonates
US4908422A · kind A · utility
5Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1989 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | Mar 6, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L69/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to thermoplastic molding compounds containing PA1 (1.) thermoplastic aromatic polycarbonates and/or thermoplastic aromatic polyesters, PA1 (2.) graft polymers and, optionally, PA1 (2.a) thermoplastic copolymers, which are characterized in that they additionally contain aliphatic polycarbonates having weight average molecular weights Mw (as measured by ultracentrifugation or light scattering) in the range from 15,000 to 500,000.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.