Connector and semiconductor device packages employing the same
US4908696A · kind A · utility
21Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1987 |
| Grant date | Mar 13, 1990 |
| Priority date | — |
| Expiry date | Sep 16, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1115
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the present invention to provide a connector structure which provides highly reliable electrical connection, together with semiconductor device package using the same. The object is attained by soldering a ceramic wiring substrate to a connector which involves a heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.