Method of making capacitive pressure sensors
US4908921A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1988 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | Aug 3, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/43
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of batch producing capacitive pressure sensors in which a sheet of semiconductive material is provided with an insulating layer 4 on one side thereof and a plurality of cavities 1 are formed in the semiconductive sheet by removing part of the insulating layer and part of the semiconductive sheet. Simultaneously with producing the cavities in the semiconductive sheet, at least one recess is provided, again by removing part of the insulating layer and part of the semiconductive sheet. The semiconductive sheet is then bonded to a non-conductive substrate 3 to form a composite sheet with the insulating layer 4 in contact with the substrate, the substrate being provided with a number of electrodes 5 corresponding to the number of cavities in the semiconductive sheet and arranged such that they are located within the cavities on bonding of the semiconductive sheet to the substrate, each electrode having an electrical feedthrough 6 extending therefrom and terminating at a point outside of the associated cavity but within an associated recess in the semiconductive sheet. The bonded composite sheet is patterned with a series of grid lines to delineate the plurality of pressure sens…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.