Method of manufacturing two-layer printed circuit sheet
US4908940A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1988 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | Dec 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulating sheet having through holes formed therein at positions where circuit patterns formed on its both surfaces are electrically connected is prepared. A sheet for forming a hole bottom is attached to one surface of the insulating sheet. Subsequently, a first-layer circuit pattern is printed on the other surface of the insulating sheet to which the hole-bottom sheet is not attached, and a conductive paste is filled into the holes. Thereafter, the hole-bottom sheet is removed. Then, a second-layer circuit pattern is printed on the surface of the insulating sheet, from which the hole-bottom sheet is removed. With this process, a two-layer printed circuit sheet is manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.