Bonding wire ball formation
US4909427A · kind A · utility
19Cited by
4References
6Claims
0Family size
Inventors
Key dates
| Filing date | May 17, 1989 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | May 17, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball bonding apparatus is provided with a "flame off" electrode which is positioned, during flame off, around and above the capillary tool so that the spark for melting the wire passes in close proximity to the end of the capillary tool. The flame off electrode is preferably mounted on the capillary tip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.