Furnace to solder integrated circuit chips
US4909428A · kind A · utility
10Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1988 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | Jul 22, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A furnace for soldering integrated circuit chips on a ceramic substrate has a heating plate supporting the substrate, the plate comprising perforations at the places where the integrated circuit chips will be soldered, behind the plate, a heat radiation source and a device to direct the radiation as desired towards only one of the apertures of the plate at a time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.