Patent · US Expired

Process for producing copper-clad laminate

US4909886A · kind A · utility

16Cited by
5References
5Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 2, 1988
Grant dateMar 20, 1990
Priority date
Expiry dateDec 2, 2008

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/1545
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A process for continuously producing a copper-clad laminate by double belt pressing which comprises heating a laminating material comprising at least one resin-impregnated base of continuous length and a copper foil of continuous length superposed on at least one of the outer surfaces of the base(s) between a pair of belts under pressure, wherein a laminating material having been continuously heat-fused under reduced pressure in a vacuum chamber is used. The pressure applied to the laminating material during heating under pressure can be reduced to a range of from 10 to 30 kg/cm.sup.2.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.