Patent · US Expired

Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces

US4910045A · kind A · utility

16Cited by

7References

8Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Henning Giesecke · Cologne, DE
Gerhard D. Wolf · Dormagen, DE
Wilfried Zecher · Leverkusen, DE

Key dates

Filing date	Dec 2, 1988
Grant date	Mar 20, 1990
Priority date	—
Expiry date	Dec 2, 2008

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/387
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.