Conditioning a dielectric substrate for plating thereon
US4910049A · kind A · utility
3Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1986 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | Dec 15, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1893
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.