Method and photosensitive material for forming metal patterns employing microcapsules
US4910118A · kind A · utility
11Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1988 |
| Grant date | Mar 20, 1990 |
| Priority date | — |
| Expiry date | Oct 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/185
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Processes for forming metal patterns such as electric circuits and photosensitive materials useful therein are disclosed wherein a layer of photosensitive microcapsules is used to form a pattern of an adhesive, a metallic pigment, a metal salt or a reducing agent by exposing the layer of microcapsules to actinic radiation and transferring the internal phase to a support member. A pattern of the pigment salt or reducing agent is thereby formed on the support member which is treated with an electroless plating solution to form the metal pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.