Semiconductor body with heat sink

US4910583A · kind A · utility

Assignee

• Licentia Patent-Verwaltungs-GmbH · DE

Inventors

• Wolfgang Behr · Thalfingen, DE
• Karl Strohm · Ulm, DE
• Johann-Friedrich Luy · Ulm, DE

Key dates

• Filing date: Jun 2, 1988
• Grant date: Mar 20, 1990
• Expiry date: Jun 2, 2008

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a semiconductor body, which is composed of at least one semiconductor device, especially one impatt-diode, with integrated heat sink. The series of semiconductor layers, out of which the semiconductor device is produced, is made up of one first p.sup.+ -doped semiconductor layer, which has the function of an etching stop layer, of a contact layer and a buffer layer at the same time.