Thick-film incubator
US4912304A · kind A · utility
Inventor
Key dates
| Filing date | Sep 9, 1987 |
| Grant date | Mar 27, 1990 |
| Priority date | — |
| Expiry date | Sep 9, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2035/00376
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thick-film incubator is used with a temperature control circuit and a mounting member on which the thick-film incubator is disposed. The thick-film incubator includes a ceramic substrate which has a first pair of conductive pads disposed at opposite ends thereof and a second pair of conductive pads disposed opposing each other thereon. A first layer of resistive ink is deposited on the ceramic substrate so that an open rectangular field is formed. The layer has a first end and a second end which are electrically coupled to each of the first pair of conductive pads, respectively, so that current can flow through the first layer in order to heat the ceramic substrate. A second layer of temperature-dependent resistive ink is deposited on the ceramic substrate adjacent, but not contiguous, to the layer of resistive ink. The second layer has a first end and a second end which are electrically coupled to each of the second pair of conductive pads, respectively, in order to electrically couple it to the temperature control circuit. The second layer has a first side and a second side. Its first side contacts the ceramic substrate in order to sense the temperature thereof. Its second side…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.