Direct-heated flow measuring apparatus having improved response characteristics
US4912975A · kind A · utility
22Cited by
24References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1989 |
| Grant date | Apr 3, 1990 |
| Priority date | — |
| Expiry date | Jan 25, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/692
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a direct-heated flow measuring apparatus including a substrate having a film resistance pattern and a supporting member for supporting the substrate, the supporting member has good heat dissipation characteristics. Provided between the substrate and the supporting member is a heat transfer throttling portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.