Halogen-free flameproof molding materials
US4914144A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1988 |
| Grant date | Apr 3, 1990 |
| Priority date | — |
| Expiry date | Dec 16, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L69/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A flameproof, halogen-free thermoplastic molding material contains, based on the molding material consisting of A, B, C, D and E, PA0 (A) 40 to 95% by weight of a thermoplastic halogen-free aromatic polycarbonate based on a diphenol, PA0 (B) from 5 to 30% by weight of one or more halogen-free graft polymers obtained from, based on B, PA1 (b.sub.1) an elastomer (rubber), which accounts for from 40 to 80% by weight, and PA1 (b.sub.2) a graft shell on this elastomer which accounts for from 20 to 60% by weight, PA0 (C) from 5 to 50% by weight of one or more halogen-free thermoplastic copolymers consisting of, based on C, from 50 to 95% by weight of styrene, .alpha.-methylstyrene, styrene which is substituted in the nucleus, methyl methacrylate or a mixture of these, and from 50 to 5% by weight of (meth)acrylonitrile, methyl methacrylate, maleic anhydride, N-substituted maleimide or a mixture of these, PA0 (D) 1 to 25% by weight of one or more halogen-free phosphorus compounds of the formula ##STR1## where R.sup.1, R.sup.2 and R.sup.3 independently of one another are each halogen-free C.sub.1 -C.sub.8 -alkyl or halogen-free C.sub.6 -C.sub.20 -aryl and n is 0 or 1, and PA0 (E) from 0.05 …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.